VM50-850C series high speed VCSEL chip

The VCSEL chip and 1xn (n = 4,12) array can be used as sample backplane, integrated waveguide and next generation optical data communication system for the development and evaluation of engineering application optical interconnection. In addition, VCSEL contacts (GS) microprobe, wire key or flip chip key separately on the top surface through grounding source.

Chip Size

Features

1. Up to 12 parallel channels

2. Highest per channel 26.5 Gbd/s PAM-4

3. High temperature stability

4. Device to device spacing 250 microns

5. Suitable for wire or flip welding

Product Parameters

Parameter	Typical	Notes
Emission wavelength	850nm
Data rate	Up to 26.5Gbd/s	PAM-4
Threshold current	< 0.5 mA
Threshold current	4 mW

Electro-optical Properties

Parameter	Symbol	Test Condition	Min	Typ	Max	Unit
Emission wavelength	λ		835		865	nm
Maximum data rate	BR	PAM-4		26.5	28	Gbd/s
Bandwidth	Symbol	BW (f3dB)		21		GHz
Rise / Fall time	τR / τF	20%-80%		12/12		ps
Threshold current	η	5-10mA	0.3		0.45	W/A
Slope efficiency	Ith				0.5	mA
Differential resistance	Rd	5-10mA		80	120	Ω
Capacitance	C			300		fF
Beam divergence	θ	FWHM		20		。
Peak output power	Pmax				4	mW
Threshold uniformity	∆Ith			0.1		mA
Slope efficiency uniformity	∆η			0.1		W/A
Slope efficiency variation	∆ηT			≤-0.5		%/K
Thermal resistance	Rthermal			2		°C/mW
Optical spectrum				Multi mode
Spectral bandwidth (RMS)	∆λRMS		0.2	0.4	0.6	nm