Integrated circuit for optical fiber communication, VCSEL laser chip, cob photoelectric engine for 10G, 40g and 100g modules, photoelectric active optical cable device, etc

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Our company is a professional optoelectronic device manufacturer and supplier in China. We provide integrated circuit, VCSEL laser chip, photoelectric engine device, photoelectric active optical cable device, etc.

    1. Dip dual in line package integrated circuit
    2. Dip dual in line package integrated circuitThis packaging method is the earliest IC packaging technology. It has the advantages of excellent performance and high reliability. It is suitable for perforation welding on PCB. It has good compatibility with motherboard and is easy to operate. The application range includes standard logic IC, memory, microcomputer circuit and other integrated circuits.
    1. BQFP quad flatpack integrated circuit
    2. BQFP quad flatpack integrated circuitThe integrated circuit of this package has pins all around, the distance between the pins is very small, and the pins are very thin. Generally, this kind of package is used in large-scale or ultra large-scale integrated circuits. It has the advantages of good performance, high reliability and low price.
    1. PLCC package integrated circui
    2. PLCC package integrated circuit The form of the package is designed for the integrated circuit package without pins. The package adopts the chip type package, the pins of which are bent inward at the edge of the chip, close to the chip, reducing the installation volume and high reliability. The application range includes precision instruments and high frequency equipment.
    1. VM50-850C series high speed VCSEL chip
    2. VM50-850C series high speed VCSEL chip The VCSEL chip and 1xn (n = 4,12) array can be used as sample backplane, integrated waveguide and next generation optical data communication system for the development and evaluation of engineering application optical interconnection.
    1. D30-850C high speed VCSEL chip
    2. D30-850C high speed VCSEL chip These high-speed top-illuminated GaAs-based pin photodetector chips are available for the usein development and evaluation of lasers and the next-generation of data communicationssystems. The chip exhibits a responsivity greater than 0.4 A/W at 850 nm.
    1. V25-850C series High speed VCESL chip
    2. V25-850C series High speed VCESL chip The chip is designed with GaAs based vertical cavity surface, multiple emission channels, high transmission rate and high stability. So the chip can be used as an engineering sample to develop and evaluate optical interconnection, optical backplane and integrated waveguide.
Featured active optical cable, optical engine device and module
We provide a variety of types of photoelectric engines and active optical cables, as well as the matching excitation chips and integrated circuit devices or modules, and provide a complete set of devices for optical fiber communication.

The optical fiber module designed by OSA can provide embedded manufacturing solutions, and the vertically integrated optical fiber component supply chain and expert design engineering services can provide support for module manufacturing.

We develop custom modules for biomedical instruments, fiber laser systems, lidar, sensors, interferometry and telecommunications。