BQFP quad flatpack integrated circuit

The integrated circuit of this package has pins all around, the distance between the pins is very small, and the pins are very thin. Generally, this kind of package is used in large-scale or ultra large-scale integrated circuits. The SMT (surface mount technology) must be used to weld the integrated circuit with the main board. SMT chips do not need to be punched on the motherboard, and there are generally designed solder joints of corresponding pins on the motherboard surface. The welding with the main board can be realized by aligning the feet with the corresponding welding points.

Features

1. Suitable for high frequency use

2. Easy operation

3. Process maturity

4. Cheapness

5. With cushion, not easy to damage

Packaging Structure Diagram

Pin Parameter

PIN	SIGNAL	DESCRIPTION
1	NC	-
2	A10	Address input
3	A8	Address input
4	A7	Address input
5	A6	Address input
6	A5	Address input
7	A4	Address input
8	A3	Address input
9	A2	Address input
10	A1	Address input
11	A0	Address input
12	NC	-
13	I/O(0)	Data Input/Output
14	I/O(1)	Data Input/Output
15	I/O(2)	Data Input/Output
16	Vss	Ground
17	I/O(3)	-
18	I/O(4)	Data Input/Output
19	I/O(5)	Data Input/Output
20	I/O(6)	Data Input/Output
21	I/O(7)	Data Input/Output
22	I/O(8)	Data Input/Output
23	CE	Chip Enable
24	A9	Address input
25	OE	Output Enable
26	NC	-
27	Vcc	+3.3V
28	WE	Write Enable
29	A11	Address input
30	CE	Chip Enable
31	A12	Address input
32	A13	Address input
33	OE	Output Enable
34	A14	Address input
35	A15	Address input
36	A16	Address input
37	A17	Address input
38	A18	Address input
39	Vcc	+3.3v
40	Vss	Ground
41	A19	Address input
42	CN	-
43	WE	Write Enable
44	A20	Address input