Integrated circuit module device
Our company designs and manufactures analog and mixed signal integrated circuits to drive new technologies on a broad market basis. Our innovative integrated circuits improve the functionality of your devices by enabling smaller, smarter, more reliable, safer, and more efficient designs. You can also design, manufacture and test specific ICs for your applications, and provide innovative integrated devices.
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- Dip dual in line package integrated circuitThis packaging method is the earliest IC packaging technology. It has the advantages of excellent performance and high reliability. It is suitable for perforation welding on PCB. It has good compatibility with motherboard and is easy to operate. The application range includes standard logic IC, memory, microcomputer circuit and other integrated circuits.
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- BQFP quad flatpack integrated circuitThe integrated circuit of this package has pins all around, the distance between the pins is very small, and the pins are very thin. Generally, this kind of package is used in large-scale or ultra large-scale integrated circuits. It has the advantages of good performance, high reliability and low price.
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- PLCC package integrated circuit The form of the package is designed for the integrated circuit package without pins. The package adopts the chip type package, the pins of which are bent inward at the edge of the chip, close to the chip, reducing the installation volume and high reliability. The application range includes precision instruments and high frequency equipment.
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