Dip dual in line package integrated circuit

This packaging method is the earliest IC packaging technology. There are two kinds of packaging materials, ceramic and plastic. It has the advantages of excellent performance and high reliability. It is suitable for punching and welding on PCB. It has good compatibility with the main board. It is easy to operate. It is suitable for small chips without too many wires. The number of pins is generally no more than 100. The integrated circuit with dip packaging has two rows of pins Insert into the chip socket with dip structure. Of course, it can also be directly inserted in the circuit board with the same number of welding holes and geometric arrangement for welding. Take special care when plugging and unplugging from the chip socket to avoid damaging the pins. The application range includes standard logic IC, memory, microcomputer circuit and other integrated circuits.

Features

1. It is suitable for punching and welding on PCB , easy to operate

2. The ratio between chip area and package area is large

3. High reliability

4. Compatible with most motherboard devices

Packaging Structure Diagram

Pin Parameter

PIN	SIGNAL	DESCRIPTION
1	GND	Ground
2	N.C.	-
3	N.C.	-
4	GND	Ground
5	SDA	I2C Data
6	GND	Ground
7	SCL	I2C Clock
8	GND	Ground
9	N.C.	-
10	VDD	3.0V Power
11	VCC	3.0V Power
12	N.C.	-
13	VCC	3.0V Power
14	GND	Ground
15	SDA	I2C Data
16	SCL	I2C Clock