PLCC package integrated circuit

The form of the package is designed for the integrated circuit package without pins. The main external material is plastic. This package adopts the chip type package, and its pins bend inward at the edge of the chip, clinging to the chip, reducing the volume and high reliability. But the disadvantage of this kind of chip is that it is very troublesome to debug and weld when it is used. In general, it is not directly welded to the printed circuit board when it is designed, but the pin conversion seat of PGA package structure is welded to the printed circuit board, and then the chip of PLCC package is installed in the installation slot of PLCC structure of the pin conversion seat, so the chip can be disassembled at any time, which is convenient for debugging. The application range includes precision instruments and high frequency equipment.

Features

1. High reliability

2. Small size

3. Demonstrate compact solution scale

4. Fully assembled and tested

Packaging Structure Diagram

Pin Parameter

PIN	SIGNAL	DESCRIPTION
1	NC	-
2	A10	Address input
3	A8	Address input
4	A7	Address input
5	A6	Address input
6	A5	Address input
7	A4	Address input
8	A3	Address input
9	A2	Address input
10	A1	Address input
11	A0	Address input
12	NC	-
13	I/O(0)	Data Input/Output
14	I/O(1)	Data Input/Output
15	I/O(2)	Data Input/Output
16	Vss	Ground
17	NC	-
18	I/O(3)	Data Input/Output
19	I/O(4)	Data Input/Output
20	I/O(5)	Data Input/Output
21	I/O(6)	Data Input/Output
22	I/O(7)	Data Input/Output
23	CE	Chip Enable
24	A9	Address input
25	OE	Output Enable
26	NC	-
27	Vcc	+5V
28	WE	Write Enable