These high-speed top-illuminated GaAs-based pin photodetector chips are available for the usein development and evaluation of lasers and the next-generation of data communicationssystems. The chip exhibits a responsivity greater than 0.4 A/W at 850 nm. The PDs are availableas individual chips or as linear arrays (4-ch, 12-ch) allowing alignment to single mode fiber ormulti mode fibers. The chip can be wire bonded or flip-chip stud bonded.
1. Single chip or 4/12 ch array
2. Up to 40 Gbit/s per channel
3. High temperature stability
4. Pitch size 250µm
Parameter | Typical |
Operating Wavelength | 700-890nm |
Data Rate | up 40 Gbit/s per channel |
Responsivity | 0.4 W/A |
Small Signal -3dB Bandwidth | 30 GHz |
Parameter | Symbol | Condition | Min | Typ | Max | Unit |
Data bit rate | BR | 40 | Gbit/s | |||
Small signal -3dB bandwidth | BW(f3db) | V(bias)=-2V | 30 | GHz | ||
Operating Wavelength | λ | 700 | 850 | 890 | nm | |
Rise / Fall time | τR / τF | 20%-80% | 9 | ps | ||
Responsivity | R | 0.4 | A/W | |||
Capacitance | C | 80 | fF | |||
Differential resistance | Rd | 5-10mA | 80 | 120 | Ω | |
Capacitance | C | 300 | fF | |||
Dark current | I(D) | V(bias)=-5v | ≤ 1 | nA |