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D30-850C high speed VCSEL chip

These high-speed top-illuminated GaAs-based pin photodetector chips are available for the usein development and evaluation of lasers and the next-generation of data communicationssystems. The chip exhibits a responsivity greater than 0.4 A/W at 850 nm. The PDs are availableas individual chips or as linear arrays (4-ch, 12-ch) allowing alignment to single mode fiber ormulti mode fibers. The chip can be wire bonded or flip-chip stud bonded.

Chip Size

Features

1. Single chip or 4/12 ch array

2. Up to 40 Gbit/s per channel

3. High temperature stability

4. Pitch size 250µm

Product Parameters

Parameter Typical
Operating Wavelength 700-890nm
Data Rate up 40 Gbit/s per channel
Responsivity 0.4 W/A
Small Signal -3dB Bandwidth 30 GHz

Electro-optical Properties

Parameter Symbol Condition Min Typ Max Unit
Data bit rate BR 40 Gbit/s
Small signal -3dB bandwidth BW(f3db) V(bias)=-2V 30 GHz
Operating Wavelength λ 700 850 890 nm
Rise / Fall time τR / τF 20%-80% 9 ps
Responsivity R 0.4 A/W
Capacitance C 80 fF
Differential resistance Rd 5-10mA 80 120
Capacitance C 300 fF
Dark current I(D) V(bias)=-5v ≤ 1 nA